Process Capability
Process Capability
Table of manufacturing capacity
| Project | Process Capability |
| Quality standard | IPC-A-610 |
| Packaging technique |
• Stencil production • PCB production • SMT • DIP • Conformal coating • Finished product assembly |
| Enterprise certification |
• ISO9001 • ISO13485 • IATF16949 • ISO14001 |
| Scope of product certification |
• UL • RoHS • SGS • REACH |
| SMT capacity | • able to 01005, BGA minimum space distance 0.2mm、QFN、CSP、CON, etc |
| • Maximum smt PCB board size: 510mm*460mm | |
| Value-added services |
• Component procurement • DFM manufacturability analysis • NPI report • PCBA rapid sample manufacturing • Hardware and plastic structural parts |
|
• BOM component analysis • After sales maintenance • Program burning |
|
| Order amount capacity |
• Sample (minimum order 1 piece) • medium amount production • large amount production |
| Testing |
• Manual QC inspection • SPI solder paste inspection • AOI optical inspection • X-ray inspection • FAI first article inspection |
|
• ICT circuit testing • FCT function testing • Aging testing • Reliability testing |